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DUBLIN, Sept. 15, 2021 /PRNewswire/ — The “Global Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), Application (RF Devices, MEMS & Sensors, LED, 3D NAND, CMOS Image Sensors), Process Type, Technology, and Region – Forecast to 2026″ report has been added to ResearchAndMarkets.com’s providing.
The worldwide semiconductor bonding market was valued at USD 887 million in 2021 and is anticipated to succeed in USD 1,059 million by 2026, rising at a CAGR of three.6% between 2021 to 2026. The rising demand for semiconductor bonding in purposes resembling electrical and hybrid automobiles is driving the expansion of semiconductor bonding market.
The semiconductor trade performs an important function in electrical and hybrid automobiles. The important thing parts required in electrical and hybrid automobiles embody energy semiconductor units resembling freewheeling diodes, ICs, MEMS, voltage enhance DC-DC converters, gasoline cell air compressors, motor drives, insulated gate bipolar transistors (IGBTs), and low-voltage energy MOSFETs. Improvements in vehicles to construct energy-efficient and environment-friendly automobiles have elevated the demand for semiconductor units resembling ICs and sensors. Car firms additionally give attention to utilizing system on chip (SoC), which provides quicker management and safe communication.
To scale back carbon emissions, using electrical and hybrid automobiles is increasing steadily in some international locations due to authorities assist and substantial investments from the automotive trade. Superior electrical vehicles supplied by a number of the key automobile producers, resembling Bayerische Motoren Werke AG (BMW) (Germany), Ford Motor Firm (US), and Toyota Motor Company (Japan), and the initiatives by a number of international locations to cut back carbon emissions have elevated using hybrid and electrical automobiles. As extra semiconductor units are utilized in electrical automobiles, the demand for semiconductor bonding tools is anticipated to extend.
Based on the Worldwide Power Company, the adoption of electrical automobiles is repeatedly growing throughout the globe, and their demand is anticipated to develop quickly within the coming years. Based on the Bloomberg New Power Finance report, the gross sales of electrical automobiles are estimated to develop to 41 million by 2040, thereby resulting in an increase within the demand for digital parts utilized in electrical automobiles.
Superior programs, resembling idling cease programs (ISS), would consequence within the progress within the semiconductor content material in conventional fuel-based automobiles. For example, in 2014, ROHM Semiconductor developed high-performance microcontrollers for numerous automotive programs, particularly in electrical and hybrid automobiles. Such developments within the automotive sector enhance the demand for semiconductor units, subsequently driving the expansion of the semiconductor bonding market.
Rising adoption of IoT and AI in automotive sector
The arrival of Business 4.0 and applied sciences resembling IoT and AI within the automotive sector would contribute considerably towards the expansion of the semiconductor bonding market. The growing demand for car connectivity would encourage new developments within the trade. With ongoing tendencies resembling touch-free human-machine interfaces revolutionizing the automotive sector, there’s a rising significance of related vehicles.
Based on a report printed by the GSM Affiliation (GSMA) in 2019, the variety of IoT connections is projected to succeed in 24.6 billion globally by 2025. Integration of IoT in automotive security and communication applied sciences is among the main causes for the anticipated progress of IoT connections. The introduction of applied sciences resembling superior driver help programs (ADAS), adaptive cruise management, and clever parking help programs would additional drive the market progress.
Mobile IoT connectivity and AI play an important function in automotive and transportation sectors, with main use instances being shared mobility, autonomous automobiles, related automobiles, telematics, sensible public transportation, and C-V2sx automobiles. The event of sensible infrastructures resembling sensible cities and clever transportation programs would speed up the implementation of AI and IoT applied sciences in automotive and transportation. As per the analyst, the related automobile market is anticipated to develop from USD 53.9 billion in 2019 to USD 166 billion by 2025; it’s anticipated to register a CAGR of 25.2% throughout 2020-2025.
The implementation of IoT and AI applied sciences in vehicles is resulting in the combination of numerous clever sensors and actuators, in addition to AI chips resembling ADAS, LiDAR, and neuromorphic chips. These parts don’t use customary packaging, as totally different clients have totally different packaging designs. The manufacturing course of of those parts includes high-precision meting out and stamping of epoxy. Some use eutectic and ultraviolet (UV) processes. This necessitates the demand for versatile multi-die and multi-process die bonding machines with excessive velocity and excessive accuracy.
Asia-Pacific is the fastest-growing area within the semiconductor bonding market
In 2020, APAC accounted for a 62.6% share of the worldwide semiconductor bonding market. The expansion of the semiconductor bonding in APAC is attributed to the presence of a number of OSAT gamers in China and Taiwan. The area additionally homes semiconductor fabrication services of some of the main IDMs, resembling Intel (US), Micron (US), NXP Semiconductors (Netherlands), SK Hynix (South Korea). Samsung (South Korea), Texas Devices (US). ASM Pacific Expertise Ltd. (Singapore), SHIBUYA CORPORATION (Japan), Kulicke & Soffa (Singapore), and Shinkawa Ltd. (Japan) are among the many main gamers on this market which have their headquarters in APAC.
Key Matters Lined:
1 Introduction
2 Analysis Methodology
3 Govt Abstract
4 Premium Insights
4.1 Enticing Alternatives in Semiconductor Bonding Market
4.2 Semiconductor Bonding Market, by Sort
4.3 Marketplace for Cloud Semiconductor Bonding, by Nation
4.4 Semiconductor Bonding Market in APAC in 2026, by Nation & Utility
4.5 Semiconductor Bonding Market, by Utility
5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Rising Demand for Miniature Digital Elements
5.2.1.2 Rising Adoption of Stacked Die Expertise in IoT Units
5.2.1.3 Rising Demand for Electrical and Hybrid Autos
5.2.2 Restraints
5.2.2.1 Excessive Value of Possession
5.2.3 Alternatives
5.2.3.1 Rising Demand for 3D Semiconductor Meeting and Packaging
5.2.3.2 Increasing IC Business in China
5.2.3.3 Rising Adoption of IoT and AI in Automotive Sector
5.2.4 Challenges
5.2.4.1 Mechanical Unbalance of Transferring Components and Skinny Wafers Being Unstable and Inclined to Injury Brought on by Stress or Stress
5.2.4.2 Elevated Complexities Associated to Miniaturized Buildings of Circuits
5.3 Worth Chain Evaluation
5.3.1 Semiconductor Bonding Worth Chain
5.3.2 Asp Evaluation
5.3.3 Rules
5.3.4 Exports-Imports Rules
5.3.5 Restriction of Hazardous Substances (RoHS) and Waste Electrical and Digital Tools (WEEE)
5.3.6 Registration, Analysis, Authorization, and Restriction of Chemical compounds (REACH)
5.4 Ecosystem
5.5 Expertise Evaluation
5.6 Case Research
5.7 Patents Evaluation
5.8 Porter’s 5 Forces Evaluation
5.9 Traits/Disruptions Impacting Buyer’s Enterprise
5.10 Commerce Evaluation
6 Semiconductor Bonding Market, by Course of Sort
6.1 Introduction
6.2 Die-To-Die Bonding
6.2.1 Die-To-Die Bonding Section is Anticipated to Develop at 4.3% CAGR
6.3 Die-To-Wafer Bonding
6.3.1 A number of Totally different Die-To-Wafer Bonding Approaches are Being Thought of for Heterogeneous Integration
6.4 Wafer-To-Wafer Bonding
6.4.1 Wafer-To-Wafer is Used for Purposes Comparable to CMOS Picture Sensors and Numerous Reminiscence and Logic Applied sciences
7 Semiconductor Bonding Market, by Expertise
7.1 Introduction
7.2 Die Bonding
7.2.1 Epoxy Die Bonding
7.2.1.1 Epoxy Bonding to Account for Largest Share of Die Bonder Tools Market on account of Low Value and Low Curing Temperature
7.2.2 Eutectic Die Bonding
7.2.2.1 Eutectic Die Bonding is Primarily Used for Fabrication of Digital Elements
7.2.3 Flip Chip Attachment
7.2.3.1 Flip Chip Attachment Methodology is Used for Making Electrical Connections to Chips
7.2.4 Hybrid Bonding (For 3D NAND)
7.2.4.1 Foremost Utility of Hybrid Bonding is in Superior 3D Machine Stacking
7.3 Wafer Bonding
7.3.1 Direct Wafer Bonding
7.3.1.1 Direct Wafer Bonding Provides Sturdy Connection on account of Covalent Forces
7.3.2 Anodic Wafer Bonding
7.3.2.1 Anodic Wafer Bonding Provides Benefit of Broad Course of Window, Which Helps in MEMS Fabrication
7.3.3 TCB Wafer Bonding
7.3.3.1 Metals Comparable to AU, CU, or AL are Used for Steel Thermocompression Bonding
7.3.4 Hybrid Bonding
7.3.4.1 Xperi Has Developed New Model of Its Hybrid Bonding Expertise
8 Semiconductor Bonding Market, by Sort
8.1 Introduction
8.2 Die Bonder
8.2.1 Handbook Die Bonders
8.2.1.1 Handbook Die Bonders Play Important Function in R&D, Testing, and Prototyping Purposes
8.2.2 Semiautomatic Die Bonders
8.2.2.1 Semiautomatic Die Bonders are Versatile and Straightforward to Use
8.2.3 Totally Automated Die Bonders
8.2.3.1 Totally Automated Die Bonders are Anticipated to Acquire Extra Market Traction
8.3 Wafer Bonder
8.3.1 UV-Launch Adhesives, Thermal-Launch Adhesives, and Solvent-Launch Adhesives are Utilized in Wafer Bonding
8.4 Flip Chip Bonder
8.4.1 Flip Chip Bonding Can Provide A number of Benefits Over Different Interconnection Processes
9 Semiconductor Bonding Market, by Utility
9.1 Introduction
9.2 MEMS and Sensors
9.2.1 Development is Pushed by Excessive Demand from Client Electronics Producers and Adoption of Affected person Monitoring Options Throughout COVID-19 Pandemic
9.3 CMOS Picture Sensors (CIS)
9.3.1 Rising Demand from Automotive Vertical is Anticipated to Drive Demand for CIS
9.4 Radiofrequency (RF) Units
9.4.1 Rising Demand for RF Units for Smartphones to Drive Semiconductor Bonding Market
9.5 LED
9.5.1 Rising Demand for LED Elements in Residence and Infrastructure Market to Increase Development Throughout Forecast Interval
9.6 3D NAND
10 Geographic Evaluation
11 Aggressive Panorama
11.1 Introduction
11.2 Income Evaluation
11.3 Market Share Evaluation, 2020
11.4 Key Participant Methods/Proper to Win
11.4.1 Overview of Methods Deployed by Key Semiconductor Bonding Firms
11.5 Aggressive Management Mapping
11.5.1 Star
11.5.2 Rising Chief
11.5.3 Pervasive
11.5.4 Participant
11.5.5 Semiconductor Bonding Market: Sort Footprint
11.6 Aggressive Conditions and Traits
11.6.1 Semiconductor Bonding Market: Product Launches, January 2018 – April 2021
11.6.2 Semiconductor Bonding Market: Offers, January 2018 – April 2021
12 Firm Profiles
12.1 Introduction
12.2 Key Gamers
12.2.1 ASM Pacific Expertise
12.2.2 Besi
12.2.3 Panasonic
12.2.4 Fasford Expertise
12.2.5 Shinkawa Ltd.
12.2.6 EV Group (EVG)
12.2.7 SUSS MicroTech SE
12.2.8 Kulicke & Soffa Industries
12.2.9 Palomar Applied sciences
12.2.10 Shibaura Mechatronics
12.3 Different Key Gamers
12.3.1 TDK Company
12.3.2 Tokyo Electron Restricted
12.3.3 Mitsubishi Heavy Industries Machine Instruments
12.3.4 Mycronic Group
12.3.5 Intel
12.3.6 Samsung
12.3.7 Canon Anelva Company
12.3.8 Finetech
12.3.9 Dr. Tresky
12.3.10 SET Company SA
12.3.11 Tokyo Ohka Koygo
12.3.12 BondTech
12.3.13 Ayumi Industries
12.3.14 Utilized Microengineering Restricted
12.3.15 Taiwan Semiconductor Manufacturing Firm (TSMC)
12.3.16 Toray Engineering
13 Appendix
For extra details about this report go to https://www.researchandmarkets.com/r/s0l1bg
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